Vol. 35, Issue 3, pp. 517-522 (2005)

Vol. 35 Issue 3 pp. 517-522

Measurement of stress as a function of temperature in Ag and Cu thin films

Adam PROSZYNSKI, Dariusz CHOCYK, Grzegorz GLADYSZEWSKI, Tomasz PIENKOS, Longin GLADYSZEWSKI

Keywords

annealing, stress measurements, thin films

Abstract

Stress measurements of 23 nm copper films and 93 nm silver films on Si (100) have been performed during thermal cycling between RT and 450°C. The changes in stress versus temperature are interpreted. The effects of treatment on microstructure and composition are studied by X-ray diffraction.

Vol. 35
Issue 3
pp. 517-522

0.59 MB

Corresponding address

Optica Applicata
Wrocław University of Science and Technology
Faculty of Fundamental Problems of Technology
Wybrzeże Wyspiańskiego 27
50-370 Wrocław, Poland

Publisher

Wrocław University of Science and Technology
Faculty of Fundamental Problems of Technology
Wybrzeże Wyspiańskiego 27
50-370 Wrocław, Poland

Contact us

  • optica.applicata@pwr.edu.pl
  • +48 71 320 23 93
  • +48 71 328 36 96