Vol. 41, Issue 2, pp. 389-394 (2011)

Abstract

This paper reviews the current state of art of vacuum encapsulation of microsystems. Different types of bonding techniques and "integrated sealing process" are described. It is concluded that the step forward in vacuum sealing of MEMS structures should be elaboration of MEMS-type micropump, which would be integrated with microsystem structure. A novel concept of a miniature orbitron pump is presented. It is also reported how vacuum inside the micropump can be measured. It is proposed that for measurement of a low vacuum level, a membrane sensor can be used, and for a high or ultra-high vacuum level - an ionization sensor. Both sensors should be integrated with a micropump structure. The results of membrane sensor study are presented.